|
|
Build Your Online Product Catalogs?
| Product Name: |
Low temperature cured underfill adhesive no halogen BGA/CSP un
|
| Supply Ability: |
100ton/year |
| Related proudcts |
low temperature cure, |
| Specifications |
50ml |
| Price Term: |
fob |
| Port of loading: |
|
| Minimum Order |
111 |
| Unit Price: |
111 |
|
Yantai Hightite Chemicals Co., LTD is specialized in the production of Low temperature cured underfill adhesive, and it is the single component thermal curing adhesive with good maintainability, rapid liquidity, good adhesion with the PCB substrate. It can be used in the assembly of mobile phones, laptops¡¯ BGA CSP etc, Comply with the requirements of
European Union RoHS :environmental protection, no halogen
Product features:
1. Good Liquidity , it can flow rapidly;
2. Thermal expansion coefficient is low, and it can reduce the thermal stress between the circuit board and the components;
3. Shock resistant, drop resistant, i***ct resistant;
4. Low temperature cured rapidly , and can repair.
Linkman: Vicky
Email: hightite10@126.com
MSN: hightitevicky@live.cn
Website: www.hightite.com
|
| Company: |
Yantai Hightite Chemicals Co,.Ltd
|
| Contact: |
Ms. Vicky wei |
| Address: |
8 mudanjiang Road,yantai |
| Postcode: |
|
| Tel: |
86 0535 6391506 |
| Fax: |
86 0535 6391206 |
| E-mail: |
|
|
|
|
Home
