About Us
      Profile
      Products
      Contact Us


Yantai Hightite Chemicals Co,.Ltd

All Products >> manufacturer >> Low temperature cured underfill adhesive no halogen BGA/CSP un

Low temperature cured underfill adhesive   no halogen BGA/CSP un

Build Your Online Product Catalogs?



Description
Product Name: Low temperature cured underfill adhesive no halogen BGA/CSP un
Supply Ability: 100ton/year
Specifications 50ml
Price Term: fob
Port of loading:
Minimum Order 111
Unit Price: 111
You may also be interested in: low temperature cure, no halogen bga/csp u, underfill adhesive,

Yantai Hightite Chemicals Co., LTD is specialized in the production of Low temperature cured underfill adhesive, and it is the single component thermal curing adhesive with good maintainability, rapid liquidity, good adhesion with the PCB substrate. It can be used in the assembly of mobile phones, laptopsí» BGA CSP etc, Comply with the requirements of
European Union RoHS :environmental protection, no halogen
Product features:
1. Good Liquidity , it can flow rapidly;
2. Thermal expansion coefficient is low, and it can reduce the thermal stress between the circuit board and the components;
3. Shock resistant, drop resistant, impact resistant;
4. Low temperature cured rapidly , and can repair.
Linkman: Vicky
Email: hightite10@126.com
MSN: hightitevicky@live.cn
Website: www.hightite.com

Contact Us
Company: Yantai Hightite Chemicals Co,.Ltd
Contact: Ms. Vicky wei
Address: 8 mudanjiang Road,yantai
Postcode:
Tel: 86 0535 6391506
Fax: 86 0535 6391206
Homepage: http://www.hightite.com
http://hightite.globalimporter.net
E-mail:         


Copyright© Yantai Hightite Chemicals Co,.Ltd All Rights Reserved.
Tel : 86 0535 6391506 Fax : 86 0535 6391206
Powered by Globalimporter